7月17日，參觀者在數(shù)字科技鏈展區(qū)高通展臺體驗搭載了高通公司芯片的產(chǎn)品。第三屆中國國際供應(yīng)鏈促進(jìn)博覽會近日在北京舉辦，本屆鏈博會不僅在先進(jìn)制造鏈展區(qū)首次設(shè)置創(chuàng)新鏈專區(qū)，還首次舉辦“鏈博首發(fā)站”新品發(fā)布專區(qū)。全球供應(yīng)鏈上的新產(chǎn)品、新工藝、新場景、新生態(tài)競相“綻放”，讓觀眾眼前一亮。[新華社記者 鞠煥宗 攝]

A visitor tries a product at the booth of Qualcomm in the Digital Technology Chain area of the third China International Supply Chain Expo (CISCE) in Beijing, capital of China, July 17, 2025. Held from July 16 to 20, the 2025 CISCE kicked off in Beijing on Wednesday. A key innovation for this edition is the "Debut Zone," dedicated to the global premieres of new products, technologies, and ecosystems, showcasing breakthrough innovations that drive industrial collaboration. (Xinhua/Ju Huanzong)